ASML High-NA EUV Lithography Delivered to Asia Customers, Advanced Process Equipment Race Upgrades

ASML High-NA EUV Opens New Era

ASML new generation High-NA EUV lithography machines have been officially delivered to Asia customers, marking a new era for global semiconductor manufacturing equipment. TSMC and Samsung have become the first High-NA EUV users, laying the foundation for mass production at 2nm and below.

High-NA EUV Technology Advantages

High-NA EUV lithography increases the numerical aperture from 0.33 to 0.55, significantly improving resolution and enabling finer patterning with fewer exposure steps. A single High-NA EUV machine costs over 350 million euros, making it the most technologically advanced equipment in semiconductor manufacturing.

TSMC and Samsung Equipment Race

TSMC and Samsung are engaged in fierce competition in the procurement and application of High-NA EUV lithography machines. TSMC plans to widely use High-NA EUV technology in 2nm process, while Samsung plans to fully adopt the technology in 1.4nm process. The equipment race between the two giants drives the continuous progress of global semiconductor manufacturing technology.