HBM4 High Bandwidth Memory R&D Enters Final Sprint, AI Computing Demand Drives Memory Technology Innovation

HBM4 Becomes New Focus of Memory Industry

With AI large models and HPC applications continuing to drive demand for memory bandwidth, HBM4 high bandwidth memory R&D and mass production have become the focus of the global memory industry. SK Hynix and Samsung Electronics, the two memory giants, are engaged in fierce competition in the HBM4 field.

SK Hynix HBM4 Technology Roadmap

As the HBM market leader, SK Hynix continues to advance HBM4 R&D based on HBM3E mass production. The company plans to launch HBM4 samples in the second half of 2025, with mass production in 2026. HBM4 will adopt more advanced stacking technology and higher data transfer rates.

Samsung HBM4 Competitive Strategy

Samsung Electronics is accelerating its catch-up in the HBM field, with its HBM3E products having passed NVIDIA verification and begun supply. In HBM4 R&D, Samsung plans to adopt innovative packaging technology to improve performance and yield.