Global Wafer Foundry Landscape Accelerates Evolution
In 2025, the global wafer foundry industry landscape is undergoing profound changes. TSMC maintains its lead with 3nm mass production and 2nm development progress, while Samsung Electronics and Intel engage in fierce competition in the 2nm process, with Asia advanced process capacity expansion entering the fast lane.
TSMC 2nm Process Progresses Smoothly
TSMC 2nm process adopts GAA transistor architecture, with risk production expected in the second half of 2025 and mass production in 2026. Hsinchu and Kaohsiung facilities will handle 2nm capacity, with initial monthly capacity expected to reach 30,000 wafers. TSMC technology accumulation and customer ecosystem advantages in advanced process remain evident.
Samsung Advances GAA Technology
Samsung Electronics was the first to adopt GAA technology in 3nm process, accumulating rich mass production experience. In 2nm process development, Samsung plans to further optimize GAA architecture, improving transistor performance and yield. Samsung Taylor fab construction in Texas is also accelerating.
Intel IDM 2.0 Strategy Continues to Advance
Intel is actively promoting its foundry business under the IDM 2.0 strategy, with its Intel 18A process (equivalent to 1.8nm) already receiving orders from multiple customers. Intel fab construction in Arizona and Ohio continues to advance, aiming to return to the global advanced process leadership.
