Setphi Chip Design Channel provides latest updates on analog, RF, digital chips and IP cores, plus analysis of new products, competitive landscape, and future trends in Asian semiconductor capital and industry.
This article deeply analyzes the latest trends in the 2026 Asian semiconductor capital expenditure strategy, focusing on the shift in investment layout driven by the dual momentum of AI and automotive chips, interpreting the strategic adjustments across various industry chain segments and their impact on the global semiconductor industry landscape.
The 2026 Asian semiconductor capital expenditure strategy is undergoing a major transformation, with AI and automotive chips serving as the dual engines driving investment growth. This article deeply analyzes the current status and trends of Asian semiconductor capital expenditure, discusses the investment strategy layouts of major enterprises, and looks at the reshaping of the supply chain and the formation of a new industry landscape, while forecasting future challenges and development opportu
This article provides an in-depth analysis of the overall situation, driving factors, and future trends of Asian semiconductor capital expenditure in 2026, revealing how AI and automotive chips are becoming dual drivers reshaping the Asian semiconductor industry investment landscape, offering forward-looking insights for industry participants.
In July 2026, TSMC established its first AI chip design R&D center in Bangalore, India. This move not only fills a gap in India's high-end chip design but also reshapes Asia's semiconductor capital and industry landscape. This article analyzes TSMC's strategic intent in India, its impact on the local industry chain, and future challenges.
In H1 2026, Asian semiconductor IC design financing exceeded $12B, a record high. AI chips, RISC-V, and automotive chips attracted capital. This article analyzes capital flows, key investors, and future trends, interpreting profound changes in Asia's semiconductor landscape.
This article deeply analyzes the current state of the semiconductor industry, focusing on HBM4 technology breakthroughs and their ability to meet AI computing power demands, discussing how high-bandwidth memory reshapes the underlying logic of AI infrastructure, and looking forward to future development trends.
This article introduces the material advantages, process breakthroughs, and application scenarios of wide bandgap semiconductors SiC and GaN, discussing their profound impact on new energy, electric vehicles, 5G communication, and other industries, revealing their irreplaceable advantages in high-temperature, high-frequency, and high-power-density scenarios.
2026-07-10 17:06:57
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