Hanmi Semiconductor & ASML Develop HBM Bonding Equipment, Adding New Dynamics to Asian Supply Chain
2026-07-28 10:40:26
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South Korea's Hanmi Semiconductor teams up with ASML to develop HBM-specific thermal compression bonding equipment for the high-bandwidth memory market. This partnership strengthens South Korea's advanced packaging role and reflects new competitive and collaborative trends in Asia's semiconductor equipment supply chain.